| CPC H01L 27/1463 (2013.01) [H01L 27/14623 (2013.01); H01L 27/1464 (2013.01); H01L 27/14685 (2013.01)] | 20 Claims |
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1. A method for forming an image sensor, comprising:
receiving a workpiece comprising a first isolation structure formed in a front side of a substrate;
forming a trench extending through the first isolation structure and a portion of the substrate;
performing a thermal oxidization to the workpiece, thereby forming a dielectric liner to line the trench;
after the forming of the dielectric liner, depositing a conductive layer conformally over the workpiece, wherein the conductive layer comprises a first portion in direct contact with the dielectric liner and a second portion in direct contact with the first isolation structure; and
depositing a dielectric fill layer over the conductive layer to fill the trench.
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