US 12,205,910 B2
Integrated circuit bond pad with multi-material toothed structure
Justin Sato, West Linn, OR (US); Bomy Chen, Newark, CA (US); Yaojian Leng, Portland, OR (US); Gerald Marsico, Monument, CO (US); and Julius Kovats, Manitou Springs, CO (US)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on May 1, 2023, as Appl. No. 18/141,621.
Application 18/141,621 is a division of application No. 17/163,645, filed on Feb. 1, 2021, granted, now 11,682,641.
Claims priority of provisional application 63/064,958, filed on Aug. 13, 2020.
Prior Publication US 2023/0260938 A1, Aug. 17, 2023
Int. Cl. H01L 21/60 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/05 (2013.01) [H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 24/89 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05578 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05724 (2013.01); H01L 2224/05839 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80895 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a multi-material toothed bond pad, the method comprising:
forming a layer of a first material;
etching the layer of the first material to define (a) a plurality of vertically-extending teeth formed from the first material and (b) open spaces between the plurality of vertically-extending teeth;
depositing a layer of the second material over the plurality of vertically-extending teeth and extending down into the open spaces between the plurality of vertically-extending teeth; and
removing portions of the second material over the plurality of vertically-extending teeth to expose upper surfaces of the plurality of vertically-extending teeth.