| CPC H01L 23/5227 (2013.01) [H01F 27/29 (2013.01); H01L 21/76898 (2013.01); H01L 28/10 (2013.01)] | 20 Claims |
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1. A semiconductor device, comprising:
a semiconductor substrate;
an interconnection layer disposed on the semiconductor substrate;
an inductor pattern disposed on and electrically connected to the interconnection layer, wherein the inductor pattern comprises:
a first conductive line joined with a first terminal;
a second conductive line joined with a second terminal; and
a plurality of conductive coils joining the first conductive line to the second conductive line, wherein the plurality of conductive coils comprises an outer coil joined with the first conductive line, an inner coil joined with the second conductive line and the outer coil, and wherein the second conductive line is spaced apart from a first side of the inner coil in a first direction by distance Y, the distance Y is equal to a spacing of loops of the plurality of conductive coils, the second terminal is spaced apart from a second side of the inner coil in a second direction by distance X1, and a relationship of the distance X1 to the distance Y satisfies: X1>1.25Y;
a plurality of auxiliary connecting elements electrically connecting the plurality of conductive coils to the interconnection layer, wherein the plurality of auxiliary connecting elements comprises a first portion of auxiliary connecting elements connected to the outer coil and a second portion of auxiliary connecting elements connected to the inner coil, and a number of the first portion of auxiliary connecting elements is equal to a number of the second portion of auxiliary connecting elements.
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