US 12,205,880 B2
Electronic device and multi-level interposer with RF sloped via and related method
Matt Bauer, Melbourne, FL (US); Timothy Clingenpeel, Melbourne, FL (US); and Beatriz Jimenez, Melbourne, FL (US)
Assigned to EAGLE TECHNOLOGY, LLC, Melbourne, FL (US)
Filed by Eagle Technology, LLC, Melbourne, FL (US)
Filed on Mar. 21, 2022, as Appl. No. 17/655,610.
Prior Publication US 2023/0298988 A1, Sep. 21, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/66 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device comprising:
at least one integrated circuit (IC);
a grid array substrate; and
a multi-level interposer coupled between the at least one IC and the grid array substrate, the multi-level interposer comprising
a plurality of dielectric layers, and a sequence of metal levels carried by respective dielectric layers, and
a radio frequency (RF) sloped via comprising
a sloped metal signal layer extending from a first metal level, through a second metal level, and to a third metal level, and
a respective sloped lateral metal ground layer spaced from and adjacent each lateral side of the sloped metal signal layer in a coplanar configuration.