US 12,205,878 B2
Continuous interconnects between heterogeneous materials
Mark William Ronay, Portland, OR (US); Jorge E. Carbo, Jr., Portland, OR (US); Trevor Antonio Rivera, Portland, OR (US); Charles J. Kinzel, Portland, OR (US); Michael Adventure Hopkins, Portland, OR (US); and Sai Srinivas Desabathina, Beaverton, OR (US)
Assigned to Liquid Wire Inc., Portland, OR (US)
Filed by Liquid Wire Inc., Portland, OR (US)
Filed on May 12, 2023, as Appl. No. 18/316,586.
Application 18/316,586 is a continuation of application No. 17/303,030, filed on May 18, 2021, granted, now 11,688,677.
Application 17/303,030 is a continuation of application No. 16/885,854, filed on May 28, 2020, granted, now 11,682,615.
Claims priority of provisional application 62/853,481, filed on May 28, 2019.
Prior Publication US 2024/0047334 A1, Feb. 8, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/52 (2006.01)
CPC H01L 23/49833 (2013.01) [H01L 21/485 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/3157 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/4985 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A deformable electronic device, comprising:
a substrate layer;
an encapsulant layer;
a trace formed from a deformable conductor disposed between the substrate layer and the encapsulant layer;
a pattern of conductive material; and
a continuous interconnect electrically coupling the trace and the pattern of conductive material, wherein the continuous interconnect comprises the deformable conductor.