US 12,205,866 B2
Semiconductor device
Chien-Chia Chiu, Taoyuan (TW); and Li-Han Hsu, Hsin-Chu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 1, 2021, as Appl. No. 17/219,909.
Application 17/219,909 is a continuation of application No. 16/373,643, filed on Apr. 3, 2019, granted, now 10,971,425.
Claims priority of provisional application 62/737,869, filed on Sep. 27, 2018.
Prior Publication US 2021/0217682 A1, Jul. 15, 2021
Int. Cl. H01L 25/00 (2006.01); H01L 23/04 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01); H01L 23/10 (2006.01)
CPC H01L 23/40 (2013.01) [H01L 23/04 (2013.01); H01L 23/16 (2013.01); H01L 23/3121 (2013.01); H01L 23/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a circuit substrate;
a chip package disposed on the circuit substrate, the chip package comprising opposite long sides and opposite short sides shorter than the opposite lone sides;
a stiffener ring disposed entirely on a first surface of the circuit substrate, the stiffener ring comprising a pair of first stiffener portions substantially parallel with the opposite long sides and a pair of second stiffener portions substantially parallel with the opposite short sides, each of the second stiffener portions of the pair of second stiffener portions connecting the pair of first stiffener portions to each other, and a first sum of volumes of the pair of first stiffener portions being greater than a second sum of volumes of the pair of second stiffener portions, wherein the pair of first stiffener portions have a different thickness than the pair of second stiffener portions;
a first electronic component disposed on the circuit substrate, the first electronic component being between the chip package and a first one of the pair of first stiffener portions; and
a second electronic component disposed on the circuit substrate, the second electronic component being between the chip package and a second one of the pair of first stiffener portions.