US 12,205,860 B2
Sensor packages
Tsung-Hsien Chiang, Hsinchu (TW); Yu-Chih Huang, Hsinchu (TW); Ting-Ting Kuo, Hsinchu (TW); Chih-Hsuan Tai, Taipei (TW); Ban-Li Wu, Hsinchu (TW); Ying-Cheng Tseng, Tainan (TW); Chi-Hui Lai, Taichung (TW); Chiahung Liu, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); Chung-Shi Liu, Hsinchu (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 12, 2023, as Appl. No. 18/351,010.
Application 17/092,543 is a division of application No. 16/266,276, filed on Feb. 4, 2019, granted, now 10,832,985, issued on Nov. 10, 2020.
Application 18/351,010 is a continuation of application No. 17/092,543, filed on Nov. 9, 2020, granted, now 11,742,254.
Claims priority of provisional application 62/737,282, filed on Sep. 27, 2018.
Prior Publication US 2023/0352357 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/3171 (2013.01) [H01L 21/565 (2013.01); H01L 21/76837 (2013.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 24/09 (2013.01); H01L 2224/02373 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a sensor die having a top surface and a bottom surface opposite the top surface, the sensor die having an input/output region and a first sensing region at the top surface;
an encapsulant at least laterally encapsulating the sensor die, the encapsulant having a top surface, a bottom surface, and a curved surface, the curved surface extending from the bottom surface of the encapsulant to a sidewall of the sensor die;
a conductive via extending through the encapsulant; and
a front-side redistribution structure on the top surface of the sensor die and the top surface of the encapsulant, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.