a chamber including an internal space;

a chuck configured to support a base film of the semiconductor device in the internal space of the chamber, wherein the semiconductor device comprises: a semiconductor substrate including a first surface extending in a horizontal direction and a second surface opposite to the first surface and extending in the horizontal direction; the first adhesive layer; a laser-responsive layer arranged on the first adhesive layer; the carrier substrate; and a second adhesive layer arranged on the second surface and having a cross-sectional area in the horizontal direction greater than a cross-sectional area of the semiconductor substrate in the horizontal direction, wherein the first adhesive layer is arranged on the first surface of the semiconductor substrate, the carrier substrate is arranged on the laser-responsive layer, and the base film is arranged under the second adhesive layer;

a light source configured to provide light to the laser-responsive layer of the semiconductor device;

a fixing ring arranged above the chuck and configured to support an edge portion of the semiconductor device; and

a cover ring arranged above the fixing ring and overlapping a portion of the second adhesive layer in a vertical direction perpendicular to the horizontal direction, the portion of the second adhesive layer arranged outside the carrier substrate, wherein the cover ring is configured to adjust a diameter of an opening exposing the carrier substrate and comprises: a guide frame arranged above the fixing ring; and a cover blade configured to move in a horizontal direction determined by the guide frame.