US 12,205,782 B2
Circuit structure, backlight module and light-emitting key device using the same
Ching-Lung Cheng, Taipei (TW); and Chin-Chia Hsu, Taipei (TW)
Assigned to LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Guangzhou (CN); and LITE-ON TECHNOLOGY CORPORATION, Taipei (TW)
Filed by LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Guangzhou (CN); and LITE-ON TECHNOLOGY CORPORATION, Taipei (TW)
Filed on Aug. 1, 2023, as Appl. No. 18/228,674.
Application 18/228,674 is a division of application No. 17/900,686, filed on Aug. 31, 2022, granted, now 11,764,008.
Application 17/900,686 is a continuation of application No. 16/904,271, filed on Jun. 17, 2020, granted, now 11,488,793, issued on Nov. 1, 2022.
Claims priority of provisional application 62/902,988, filed on Sep. 20, 2019.
Claims priority of provisional application 62/863,251, filed on Jun. 18, 2019.
Prior Publication US 2023/0377817 A1, Nov. 23, 2023
Int. Cl. G02B 6/00 (2006.01); F21V 8/00 (2006.01); H01H 13/83 (2006.01)
CPC H01H 13/83 (2013.01) [G02B 6/005 (2013.01); G02B 6/0088 (2013.01); H01H 2219/06 (2013.01); H01H 2219/0622 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A backlight module, comprises:
a light guide plate having a light-exit surface and an opposite surface opposite to the light-exit surface;
a circuit structure comprising:
a light-transmissive insulation layer;
a patterned conductive layer disposed on the light-transmissive insulation layer;
an electronic component disposed on the patterned conductive layer and electrically connected to the patterned conductive layer, wherein the electronic component is a light-emitting component;
a protection layer covering the electronic component; and
a pad layer disposed between the protection layer and the patterned conductive layer and surrounding the electronic component; and
a protection sheet;
wherein the circuit structure is disposed on one of the light-exit surface and the opposite surface, and the protection sheet is disposed on another of the light-exit surface and the opposite surface;
wherein the light-transmissive insulation layer is formed of a light-transmissive material;
wherein the electronic component is disposed between the patterned conductive layer and the protection layer;
wherein the electronic component is a light-emitting element, and the protection sheet overlaps a keycap up and down.