	US 12,205,775 B2
	Process to improve coverage and electrical performance of solid electrolytic capacitors
Yaru Shi, Simpsonville, SC (US); Antony P. Chacko, Simpsonville, SC (US); and Ajaykumar Bunha, Simpsonville, SC (US)
Assigned to KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed by KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed on Mar. 30, 2022, as Appl. No. 17/708,196.
Application 17/708,196 is a continuation in part of application No. 16/429,936, filed on Jun. 3, 2019, granted, now 11,393,637.
Claims priority of provisional application 63/173,761, filed on Apr. 12, 2021.
Prior Publication US 2022/0223351 A1, Jul. 14, 2022
Int. Cl. H01G 9/15 (2006.01); H01G 9/00 (2006.01); H01G 9/028 (2006.01); H01G 9/048 (2006.01); H01G 9/04 (2006.01)

CPC H01G 9/15 (2013.01) [H01G 9/0032 (2013.01); H01G 9/028 (2013.01); H01G 9/048 (2013.01); H01G 2009/05 (2013.01)]

38 Claims

1. A method for forming a solid electrolytic capacitor comprising:

providing an anode with an anode lead extending therefrom;

forming a dielectric on said anode thereby forming an anodized anode; and

forming a cathode layer over said dielectric by:

applying a conductive polymer solution or dispersion; and

applying a primer solution or dispersion comprising a monophosphonium or monosulfonium cation.