US 12,205,755 B2
Inductor structure
Hsiao-Tsung Yen, Hsinchu (TW); and Ka-Un Chan, Hsinchu (TW)
Assigned to REALTEK SEMICONDUCTOR CORPORATION, Hsinchu (TW)
Filed by Realtek Semiconductor Corporation, Hsinchu (TW)
Filed on Jan. 27, 2021, as Appl. No. 17/159,430.
Claims priority of application No. 109128973 (TW), filed on Aug. 25, 2020.
Prior Publication US 2022/0068552 A1, Mar. 3, 2022
Int. Cl. H01F 27/28 (2006.01); H01F 27/29 (2006.01)
CPC H01F 27/29 (2013.01) [H01F 27/2823 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inductor structure, comprising:
a first connecting component, wherein a first port of the first connecting component is coupled to a first wire, and a second port of the first connecting component is coupled to a second wire;
a second connecting component, disposed above or beneath the first connecting component in an interlaced manner; and
a center-tap terminal, coupled to one of the first connecting component and the second connecting component, such that the center-tap terminal and one of the first connecting component and the second connecting component are disposed on a same layer, and the center-tap terminal and another one of the first connecting component and the second connecting component are disposed on different layers;
wherein the one of the first connecting component and the second connecting component includes a vertical projection that the first connecting component is interlaced with the second connecting component, wherein the center-tap terminal includes a portion that the center-tap terminal is coupled to the one of the first connecting component and the second connecting component, wherein the vertical projection at least partially overlaps with the portion.