US 12,205,748 B2
Inductor device
Hsiao-Tsung Yen, Hsinchu (TW); Hung-Han Chen, Hsinchu (TW); and Ka-Un Chan, Hsinchu (TW)
Assigned to REALTEK SEMICONDUCTOR CORPORATION, Hsinchu (TW)
Filed by Realtek Semiconductor Corporation, Hsinchu (TW)
Filed on Aug. 23, 2021, as Appl. No. 17/408,632.
Claims priority of application No. 109128807 (TW), filed on Aug. 24, 2020.
Prior Publication US 2022/0059277 A1, Feb. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/28 (2006.01); H01F 27/29 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/2823 (2013.01); H01F 27/29 (2013.01); H01F 2027/2809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inductor device, comprising:
a first trace, comprising:
a first sub-trace, comprising a plurality of first wires; and
a second sub-trace, comprising a plurality of second wires, and coupled to the first sub-trace at a first node, wherein the first wires and the second wires are disposed to each other in an interlaced manner, and located at an outer side of the inductor device;
a second trace, comprising:
a third sub-trace, comprising a plurality of third wires; and
a fourth sub-trace, comprising a plurality of fourth wires, and coupled to the third sub-trace at a second node, wherein the third wires and the fourth wires are disposed to each other in an interlaced manner, and located at an outer side of the inductor device; and
a capacitor, coupled between the first node and the second node.