US 12,205,501 B2
Electronic device
Chin-Lung Ting, Miao-Li County (TW); Chung-Kuang Wei, Miao-Li County (TW); Li-Wei Mao, Miao-Li County (TW); Chi-Liang Chang, Miao-Li County (TW); and Chia-Hui Lin, Miao-Li County (TW)
Assigned to InnoLux Corporation, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on May 22, 2024, as Appl. No. 18/671,953.
Application 17/161,617 is a division of application No. 16/362,676, filed on Mar. 24, 2019, granted, now 10,957,226, issued on Mar. 23, 2021.
Application 18/671,953 is a continuation of application No. 18/372,709, filed on Sep. 26, 2023, granted, now 12,020,602.
Application 18/372,709 is a continuation of application No. 18/075,434, filed on Dec. 6, 2022, granted, now 11,810,485, issued on Nov. 7, 2023.
Application 18/075,434 is a continuation of application No. 17/567,176, filed on Jan. 3, 2022, granted, now 11,551,587, issued on Jan. 10, 2023.
Application 17/567,176 is a continuation of application No. 17/161,617, filed on Jan. 28, 2021, granted, now 11,250,738, issued on Feb. 15, 2022.
Claims priority of provisional application 62/660,222, filed on Apr. 19, 2018.
Claims priority of application No. 201811103070.4 (CN), filed on Sep. 20, 2018.
Prior Publication US 2024/0312375 A1, Sep. 19, 2024
Int. Cl. G09F 9/302 (2006.01); G09G 3/32 (2016.01)
CPC G09F 9/3026 (2013.01) [G09G 3/32 (2013.01); G09G 2300/026 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate having a plurality of first through holes;
a plurality of bumps disposed on the substrate;
a plurality of diodes disposed on the substrate; and
a shielding layer disposed on the substrate;
wherein one of the plurality of bumps is located between two adjacent ones of the plurality of diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the plurality of bumps and at least a portion of the plurality of first through holes.