US 12,205,061 B2
Shared data induced quality control for a chemical mechanical planarization process
Cesar Clavero, Half Moon Bay, CA (US); Vid Gopal, Sunnyvale, CA (US); Ryan Clarke, San Jose, CA (US); Esmeralda Yitamben, Milpitas, CA (US); Hieu Pham, Santa Clara, CA (US); Anupama Mallikarjunan, Shihlin District (TW); Rung-Je Yang, Hsinchu (TW); Shirley Lin, Hsinchu (TW); Hongjun Zhou, Chandler, AZ (US); Joseph Rose, Gilbert, AZ (US); Krishna Murella, Phoenix, AZ (US); and Lu Gan, Chandler, AZ (US)
Assigned to Versum Materials US, LLC, Tempe, AZ (US)
Filed by Versum Materials US, LLC, Tempe, AZ (US)
Filed on May 18, 2022, as Appl. No. 17/663,899.
Claims priority of provisional application 63/362,645, filed on Apr. 7, 2022.
Prior Publication US 2023/0325751 A1, Oct. 12, 2023
Int. Cl. G06Q 10/0639 (2023.01); G06Q 50/04 (2012.01)
CPC G06Q 10/06395 (2013.01) [G06Q 50/04 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for ensuring product quality in a semiconductor device manufacturing process using Chemical mechanical planarization comprising the following steps:
acquiring the composition for at least two slurries as raw material data (17) for the CMP based manufacturing process and its relevant parameters (2) by using a Data Collecting computer (9);
physically performing specific method steps of a CMP process;
measuring relevant parameters of the used slurries and the physically performed CMP process to determine the CMP process performance by using the Data Collecting computer (9);
analyzing the measured data about the relevant parameters with a specific software performed on an Analyzing computer (11) by creating for the software and applying with it a predictive model using Machine Learning to understand the intercorrelation of the different parameters and using the results to improve the CMP process performance and the resulting product quality of the CMP based manufacturing process.