US 12,204,961 B2
Resistive and digital processing cores
John Paul Strachan, San Carlos, CA (US); Dejan S. Milojicic, Palo Alto, CA (US); Martin Foltin, Fort Collins, CO (US); Sai Rahul Chalamalasetti, Milpitas, CA (US); and Amit S. Sharma, Milpitas, CA (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed on Dec. 4, 2023, as Appl. No. 18/528,086.
Application 18/528,086 is a continuation of application No. 17/049,031, granted, now 11,861,429, previously published as PCT/US2018/030125, filed on Apr. 30, 2018.
Prior Publication US 2024/0111970 A1, Apr. 4, 2024
Int. Cl. G06J 1/00 (2006.01); G06F 17/16 (2006.01)
CPC G06J 1/00 (2013.01) [G06F 17/16 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a first processing core comprising a resistive memory array;
a digital processing core comprising a digital memory; and
a controller coupled to the first processing core and the digital processing core to selectively apply:
a first input data to the first processing core to perform an analog computation; and
a second input data to the digital processing core to perform a conditional operation.