	US 12,204,826 B2
	Method and apparatus for inspection and metrology
Lotte Marloes Willems, Eindhoven (NL); Kaustuve Bhattacharyya, Veldhoven (NL); Panagiotis Pieter Bintevinos, Best (NL); Guangqing Chen, Fremont, CA (US); Martin Ebert, Valkenswaard (NL); Pieter Jacob Mathias Hendrik Knelissen, Roermond (NL); Stephen Morgan, Son en Breugel (NL); Maurits Van Der Schaar, Eindhoven (NL); Leonardus Henricus Marie Verstappen, Weert (NL); Jen-Shiang Wang, Sunnyvale, CA (US); and Peter Hanzen Wardenier, Eindhoven (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
Filed on Jan. 10, 2023, as Appl. No. 18/095,515.
Application 18/095,515 is a continuation of application No. 15/559,759, granted, now 11,580,274, previously published as PCT/EP2016/056662, filed on Mar. 24, 2016.
Claims priority of provisional application 62/146,079, filed on Apr. 10, 2015.
Prior Publication US 2023/0185990 A1, Jun. 15, 2023
Int. Cl. G03F 7/00 (2006.01); G03F 9/00 (2006.01); G06F 30/20 (2020.01); G06F 111/10 (2020.01)

CPC G06F 30/20 (2020.01) [G03F 7/705 (2013.01); G03F 7/70625 (2013.01); G03F 7/70633 (2013.01); G03F 7/70683 (2013.01); G03F 9/7046 (2013.01); G06F 2111/10 (2020.01)]

20 Claims

1. A method comprising:

performing a computer simulation of how a metrology tool performs a measurement or inspection of a metrology target for physical manufacture on or in a semiconductor wafer for each of a plurality of metrology recipes for the metrology tool taking a value of an expected process condition into account, each metrology recipe comprising a measurement beam wavelength and the process condition representing a physical condition of, or in, the target, the wafer, the metrology tool, the measurement or inspection, and/or the physical manufacture;

receiving measurement data of the metrology target, wherein the measurement data has been generated using the plurality of metrology recipes; and

using the measurement data to verify the value of the expected process condition.