US 12,204,313 B2
Method of making semiconductor devices and control system for performing the same
Ching-Hsi Nan, Hsinchu (TW); Chia-Jung Chang, Hsinchu (TW); and Yu-Hsiu Fu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Aug. 19, 2021, as Appl. No. 17/406,548.
Application 17/406,548 is a continuation of application No. 16/844,533, filed on Apr. 9, 2020, granted, now 11,119,469.
Application 16/844,533 is a continuation of application No. 14/015,346, filed on Aug. 30, 2013, granted, now 10,642,255, issued on May 5, 2020.
Prior Publication US 2021/0382458 A1, Dec. 9, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G05B 19/41 (2006.01); G05B 19/418 (2006.01); G05B 23/02 (2006.01); H01L 21/67 (2006.01)
CPC G05B 19/418 (2013.01) [G05B 19/41875 (2013.01); G05B 23/02 (2013.01); G05B 2219/45031 (2013.01); H01L 21/67 (2013.01); Y02P 90/02 (2015.11); Y02P 90/80 (2015.11)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
calculating a processing tool offset for a processing tool based on a plurality of process control parameters during operation of the processing tool, wherein the processing tool offset is a first portion of a process offset time attributable to the processing tool;
calculating a product offset, wherein the processing tool offset is a second portion of the process offset time attributable to a product;
determining whether the product offset is stable based on a pre-determined tolerance and a number of processed wafers;
calculating an offset time for processing the product using the processing tool based on the calculated processing tool offset, without considering the product offset in response to a determination that the product offset is stable; and
controlling the processing tool based on the calculated offset time.