US 12,204,258 B2
Managing multi-objective alignments for imprinting
Jeremy Lee Sevier, Austin, TX (US); Satish Sadam, Round Rock, TX (US); Joseph Michael Imhof, Austin, TX (US); Kang Luo, Austin, TX (US); Kangkang Wang, Austin, TX (US); Roy Matthew Patterson, Hutto, TX (US); Qizhen Xue, Austin, TX (US); Brett William Best, Round Rock, TX (US); Charles Scott Carden, Austin, TX (US); Matthew S. Shafran, Fletcher, NC (US); and Michael Nevin Miller, Austin, TX (US)
Assigned to Magic Leap, Inc., Plantation, FL (US)
Appl. No. 18/014,327
Filed by Magic Leap, Inc., Plantation, FL (US)
PCT Filed Aug. 6, 2021, PCT No. PCT/US2021/045118
§ 371(c)(1), (2) Date Jan. 3, 2023,
PCT Pub. No. WO2022/032204, PCT Pub. Date Feb. 10, 2022.
Claims priority of provisional application 63/062,527, filed on Aug. 7, 2020.
Prior Publication US 2023/0296993 A1, Sep. 21, 2023
Int. Cl. G03F 9/00 (2006.01); G03F 7/00 (2006.01)
CPC G03F 9/7042 (2013.01) [G03F 7/0002 (2013.01); G03F 9/7011 (2013.01); G03F 9/7046 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An imprinting method comprising:
drawing a template roll along rollers, the template roll comprising a template field having a template and a template fiducial mark of the template;
measuring the template fiducial mark of the template to determine a template offset;
moving a substrate with resist on a stage to be below the template of the template roll based on an imprinting alignment offset, the imprinting alignment offset being at least partially determined based on the template offset, the resist being on a first side of the substrate;
pressing the template of the template roll into the resist on the substrate;
curing the resist to form an imprint on the substrate, the imprint having an imprinted feature corresponding to the template and an imprint fiducial mark corresponding to the template fiducial mark of the template;
measuring the imprint fiducial mark of the imprint to determine a wafer registration offset between a target fiducial location and an actual fiducial location associated with the imprint fiducial mark; and
determining an overlay bias of the imprint on the first side of the substrate at least partially based on the wafer registration offset.