US 12,204,209 B2
Display panel and preparation method thereof, and display device
Wei Cao, Beijing (CN); Xiaona Liu, Beijing (CN); and Yu Ma, Beijing (CN)
Assigned to BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/622,694
Filed by Beijing BOE Display Technology Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Feb. 25, 2021, PCT No. PCT/CN2021/077969
§ 371(c)(1), (2) Date Dec. 23, 2021,
PCT Pub. No. WO2022/178783, PCT Pub. Date Sep. 1, 2022.
Prior Publication US 2023/0152633 A1, May 18, 2023
Int. Cl. G02F 1/1339 (2006.01); G02F 1/1333 (2006.01); G02F 1/1337 (2006.01); G02F 1/1343 (2006.01); H01L 27/12 (2006.01)
CPC G02F 1/1339 (2013.01) [G02F 1/133354 (2021.01); G02F 1/1337 (2013.01); G02F 1/134345 (2021.01); G02F 1/133345 (2013.01); G02F 2201/07 (2013.01); H01L 27/1218 (2013.01); H01L 27/124 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A display panel having a display area and a non-display area adjacent to the display area, wherein the display panel comprises:
an array substrate on which a bonding electrode is arranged, wherein the bonding electrode is located in the non-display area;
an opposite substrate, arranged opposite to the array substrate;
a first alignment film, arranged on a side of the array substrate close to the opposite substrate; and
a retaining wall structure, arranged on the side of the array substrate close to the opposite substrate, wherein at least a part of the retaining wall structure is located between the first alignment film and the bonding electrode,
wherein the array substrate in the non-display area comprises:
a first base substrate;
a buffer layer, arranged on a side of the first base substrate;
a bonding lead, arranged on a side of the buffer layer away from the first base substrate; and
an insulating layer group, arranged on a side of the bonding lead away from the first base substrate, wherein the insulating layer group is provided with a notch, so that the bonding lead is exposed to form the bonding electrode.