| CPC G01R 31/2877 (2013.01) [G05B 15/02 (2013.01)] | 20 Claims |
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1. In a tester system comprising a thermal management head and a test processor, a method of performing thermal management for an integrated circuit device under test (“DUT”),
wherein said DUT comprises at least one integrated circuit singulated from a wafer, the method comprising:
disposing said DUT into a socket, wherein said DUT is electrically coupled to said socket, to form a socket-DUT assembly;
disposing an active thermal interposer device adjacent to a cold plate of said thermal management head;
disposing said socket-DUT assembly on said active thermal interposer device, wherein said DUT comprises a singulated die and wherein said active thermal interposer device comprises a plurality of zones, each zone of said plurality of zones operable to be selectively heated;
receiving a respective set of inputs, wherein at least one input of said set of inputs corresponds to a temperature of said die;
testing said singulated die using said test processor;
concurrently with said testing, performing a thermal management process with respect to said singulated die by: 1) controlling cooling to said cold plate; and 2) controlling heating of said plurality zones of said active thermal interposer device.
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