US 12,203,923 B2
Biosensor cartridges and test device therefor
Kyoungtaek Lim, Seoul (KR); Taekyu Choi, Seoul (KR); Younghwan Kim, Seoul (KR); Seonggeun Kim, Seoul (KR); Changseok Kim, Seoul (KR); Kyungho Kong, Seoul (KR); Kyounghwa Kim, Seoul (KR); Youngrae Lee, Seoul (KR); and Inkwan Yeo, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Filed by LG ELECTRONICS INC., Seoul (KR)
Filed on Nov. 23, 2022, as Appl. No. 17/993,841.
Claims priority of application No. 10-2022-0047913 (KR), filed on Apr. 19, 2022.
Prior Publication US 2023/0333085 A1, Oct. 19, 2023
Int. Cl. G01N 33/487 (2006.01); A61B 5/00 (2006.01); A61B 5/05 (2021.01); A61B 10/00 (2006.01); B01L 3/00 (2006.01); G01N 27/414 (2006.01); G01N 33/543 (2006.01); G06K 7/14 (2006.01); G06Q 20/32 (2012.01); H01R 12/72 (2011.01); H05K 1/18 (2006.01)
CPC G01N 33/48785 (2013.01) [A61B 5/0022 (2013.01); A61B 5/05 (2013.01); A61B 5/742 (2013.01); A61B 5/7495 (2013.01); A61B 10/0045 (2013.01); B01L 3/502715 (2013.01); G01N 27/4145 (2013.01); G01N 33/48707 (2013.01); G01N 33/48778 (2013.01); G01N 33/5438 (2013.01); G06K 7/1417 (2013.01); G06K 7/1447 (2013.01); G06Q 20/3223 (2013.01); H01R 12/72 (2013.01); H05K 1/181 (2013.01); B01L 2200/027 (2013.01); B01L 2200/04 (2013.01); B01L 2200/16 (2013.01); B01L 2300/022 (2013.01); B01L 2300/023 (2013.01); B01L 2300/027 (2013.01); B01L 2300/0636 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0663 (2013.01); B01L 2300/0848 (2013.01); B01L 2300/0861 (2013.01); H01R 2201/12 (2013.01); H01R 2201/20 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10386 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A probe device for testing a sensor chip that detects a target material from an applied analysis specimen, has a reactant reacting specifically with the target material, and transmits a generated electrical signal, the probe device comprising:
a lower housing configured to accommodate a circuit board of the sensor chip, the circuit board including a connection terminal configured to be electrically connected to an external test device;
a middle housing coupled to the lower housing, the middle housing configured to have the sensor chip mounted thereon;
a probe module including a plurality of probe pins for connecting a pad of the sensor chip to a connection pad of the circuit board; and
an upper housing coupled to the middle housing, the upper housing including a guide area having a recessed portion that exposes a sensor area of the sensor chip,
wherein the middle housing includes a plurality of pin openings which exposes the connection pad of the circuit board, and
wherein some of the plurality of probe pins passes through the plurality of pin openings.