US 12,203,811 B2
Process for manufacturing a device for detecting electromagnetic radiation, comprising a getter material
Geoffroy Dumont, Grenoble (FR); and Sébastien Becker, Grenoble (FR)
Assigned to COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Appl. No. 17/764,381
Filed by COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
PCT Filed Sep. 28, 2020, PCT No. PCT/EP2020/077050
§ 371(c)(1), (2) Date Mar. 28, 2022,
PCT Pub. No. WO2021/063861, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 19 10797 (FR), filed on Sep. 30, 2019.
Prior Publication US 2022/0291044 A1, Sep. 15, 2022
Int. Cl. H01L 33/26 (2010.01); G01J 5/02 (2022.01); H10N 15/10 (2023.01)
CPC G01J 5/024 (2013.01) [H10N 15/10 (2023.02)] 14 Claims
OG exemplary drawing
 
1. A process for fabricating a device for detecting electromagnetic radiation, comprising:
producing, on a substrate, at least one thermal detector, which is covered by at least one mineral sacrificial layer made of a mineral material able to be removed by a first chemical etch;
producing a through-aperture that extends through the mineral sacrificial layer and that opens onto the substrate;
producing a getter segment made of a metal that has a gettering effect, the getter segment being placed on and in contact with the substrate and at a distance from the thermal detector in a plane parallel to the substrate, the getter segment being located in the through-aperture, at a distance from a lateral border that is defined by the mineral sacrificial layer and that bounds the through-aperture in the plane parallel to the substrate;
producing a carbon-containing sacrificial layer made of a carbon-containing material that is inert to the first chemical etch and that is able to be removed by a second chemical etch, so as to cover the getter segment and to surround it in the plane parallel to the substrate, and to completely fill the through-aperture;
producing a thin encapsulation layer comprising: a top portion that rests on the mineral sacrificial layer and on the carbon-containing sacrificial layer; and a peripheral portion that extends through the mineral sacrificial layer and that surrounds the thermal detector and the getter segment;
removing the mineral sacrificial layer via the first chemical etch; and
removing the carbon-containing sacrificial layer via the second chemical etch.