CPC C23C 14/541 (2013.01) [C23C 14/24 (2013.01); C23C 14/562 (2013.01)] | 16 Claims |
1. A material deposition apparatus for depositing an evaporated material onto a substrate, the material deposition apparatus comprising:
a processing drum having a cooler configured to control a substrate temperature during processing of the substrate on the processing drum;
a roller guiding the substrate towards the processing drum;
a first heater assembly positioned to heat the substrate in a free-span area between the roller and the processing drum;
a second heater assembly positioned to heat the substrate while the substrate is supported on the processing drum;
at least one deposition source provided along a substrate transport path downstream of the second heater assembly;
a substrate speed sensor providing a speed signal correlating with a substrate transportation speed; and
a controller having an input for the speed signal configured to control at least the first heater assembly based on the speed signal, the controller further comprising:
a memory storing computer readable instructions; and
a processor coupled to the memory, the processor configured by the computer readable instructions that when executed by the processor perform a plurality of operations for depositing the evaporated material onto the substrate, the plurality of operations comprising:
guiding the substrate from the roller through the free-span area towards the processing drum at the substrate transportation speed;
receiving the speed signal from the substrate speed sensor;
heating the substrate from a first substrate temperature to a second substrate temperature with the first heater assembly, based on the speed signal, to provide a speed-dependent heating of the substrate in the free-span area before the substrate comes into contact with the processing drum; and
depositing the evaporated material onto the substrate using the at least one deposition source as the substrate travels along the substrate transport path on the processing drum.
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