US 12,202,935 B2
Resin compound and resin composition containing the same
Meei-Yu Hsu, Hsinchu (TW); Chih-Hao Lin, Taoyuan (TW); Kai-Chi Chen, Nantou County (TW); and Yi-Chun Chen, Hsinchu (TW)
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed by INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed on Feb. 1, 2022, as Appl. No. 17/590,530.
Claims priority of application No. 110145160 (TW), filed on Dec. 3, 2021.
Prior Publication US 2023/0174709 A1, Jun. 8, 2023
Int. Cl. C08G 61/12 (2006.01); C07C 13/61 (2006.01)
CPC C08G 61/12 (2013.01) [C07C 13/61 (2013.01); C07C 2602/26 (2017.05); C08G 2261/135 (2013.01); C08G 2261/312 (2013.01); C08G 2261/3325 (2013.01); C08G 2261/344 (2013.01)] 9 Claims
 
1. A resin compound having a structure represented by chemical formula (II):

OG Complex Work Unit Chemistry
wherein each R1 independently represents a C1-C20 alkylene group or a C7-C40 alkylarylene group;
each R2 independently represents a C1-C20 alkyl group or a C2-C20 terminal alkenyl group, and
each R3 independently represents a single bond or a C1-C18 alkylene group;
m independently represents an integer of 0-3, and
each R1, R2, and R3 are the same or different from each other.