US 12,202,918 B2
Photocurable (meth)acrylate compositions
Shuhua Jin, Cheshire, CT (US); and Chih-Min Cheng, Westford, MA (US)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed on Mar. 14, 2022, as Appl. No. 17/654,639.
Application 17/654,639 is a continuation of application No. PCT/US2020/051652, filed on Sep. 18, 2020.
Claims priority of provisional application 62/902,611, filed on Sep. 19, 2019.
Prior Publication US 2022/0204660 A1, Jun. 30, 2022
Int. Cl. C08F 2/50 (2006.01); B01D 67/00 (2006.01); B01D 69/12 (2006.01); C08F 220/20 (2006.01); C08F 220/56 (2006.01); C08F 222/10 (2006.01); C08G 18/12 (2006.01)
CPC C08F 2/50 (2013.01) [B01D 67/0088 (2013.01); B01D 69/1214 (2022.08); B01D 69/125 (2013.01); C08F 220/20 (2013.01); C08F 220/56 (2013.01); C08F 222/102 (2020.02); C08F 222/1065 (2020.02); C08G 18/12 (2013.01)] 24 Claims
 
1. A photocurable composition comprising
a) a (meth)acrylate-functionalized urethane component;
b) a (meth)acrylate monomer; and
c) a photoinitiator,
wherein the (meth)acrylate-functionalized urethane component comprises isocyanate functionality and/or the photocurable composition further comprises:
d) an isocyanate-functionalized adhesion promoter, and
wherein when deposited on a polyamide surface of a substrate and exposed to UV or visible light the curable composition forms a cured reaction product on the polyamide surface of the substrate and the cured reaction product demonstrates an adhesion to the polyamide surface of the substrate characterized by:
1) substrate failure after immersion in acidic, aqueous (pH=1.5) conditions for about 1 week at a temperature of about 50° C.; and/or
2) Substrate failure after immersion in basic, aqueous (pH=12.5) conditions for about 1 week at a temperature of about 50° C.; and/or
3) Substrate failure after immersion in neutral, aqueous (pH=7.0) conditions for about 1 week at a temperature of about 50° C.,
wherein the substrate is a reverse osmosis membrane with a polyamide surface,
wherein the isocyanate-functionalized adhesion promoter is present in an amount of about 5% to about 60% by weight based on the total weight of the curable composition, wherein the cured reaction product also demonstrates an adhesion to the polyamide surface of the substrate characterized by substrate failure prior to immersion in aqueous conditions.