providing a robot to be corrected, wherein the robot comprises a first robot located in a first chamber;

providing a correction device, wherein the correction device comprises a jig wafer comprising a first jig wafer; wherein the first jig wafer comprises a first wafer body, a first jig, and a first distance measuring sensor; the first jig is located on a front surface of the first wafer body, and the first distance measuring sensor is located at a central position of a back surface of the first wafer body;

transferring the first jig wafer onto ejector pins raised at a wafer chuck in the first chamber by using the first robot;

detecting a distance from a center of the first wafer body to an edge ring arranged on an edge of the wafer chuck by using the first distance measuring sensor facing the wafer chuck to obtain a collected data;

comparing the distance detected from the center of the first wafer body to the edge ring arranged on the edge of the wafer chuck with a target distance, and when a deviation between the distance detected and the target distance is outside a first preset range, determining that the first robot needs to be corrected;

obtaining a first compensation value according to the deviation between the distance detected from the center of the first wafer body to the edge ring arranged on the edge of the wafer chuck and the target distance; and

compensating for the first robot based on the first compensation value to correct the first robot.