receiving, at a controller including a processor in communication with memory, an output from a pad wear detection module corresponding to a state of a CMP pad on a first platen of a plurality of platens of a platen carrier;

positioning a pad tape replacement module proximate to the first platen responsive to an output of the pad wear detection module, the pad tape replacement module including a pad tape supply having a plurality of pads disposed therein;

rotating the platen carrier toward a pad tearer tool movably positioned adjacent to the platen carrier;

engaging the pad tearer tool to remove the CMP pad on the first platen; and

rolling, via a pressure roller of the pad tape replacement module, a pad disposed in the pad tape supply onto a second platen of the plurality of platens of the platen carrier.