US 12,202,092 B1
System and method for polishing the edge of an electronic device
Krithika Muthuveerappan, Exton, PA (US); Nidhin Davis, Glen Mills, PA (US); Siddharth Maheshwari, King of Prussia, PA (US); and Jaclyn Domsohn, Downingtown, PA (US)
Assigned to Communications Test Design, Inc., West Chester, PA (US)
Filed by Communications Test Design, Inc., West Chester, PA (US)
Filed on May 20, 2024, as Appl. No. 18/668,321.
Int. Cl. B24B 29/02 (2006.01); B24B 41/00 (2006.01); B24B 41/02 (2006.01); B24B 51/00 (2006.01)
CPC B24B 29/02 (2013.01) [B24B 41/005 (2013.01); B24B 41/02 (2013.01); B24B 51/00 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A system for polishing the edges of an electronic device, the system comprising:
a chamber comprised of a frame having a plurality of sidewalls secured thereto;
a robot arm configured to secure to and move an electronic device;
a polishing machine secured to the frame within range of the robot arm;
a polishing compound plate secured to a pneumatic actuator which is configured to raise and lower the polishing compound plate;
at least one polishing compound located on the polishing compound plate,
wherein, polishing compound is applied to the machine by extension of the pneumatic actuator.