CPC H10B 12/315 (2023.02) [H10B 12/0335 (2023.02); H10B 12/34 (2023.02); H10B 12/482 (2023.02)] | 28 Claims |
1. A semiconductor device, comprising:
a bit line structure including a bit line contact plug, a bit line, and a bit line hard mask that are sequentially stacked over a substrate;
a storage node contact plug that is spaced apart from the bit line structure;
a conformal spacer that is positioned between the bit line and the storage node contact plug and includes a low-k material; and
a seed liner that is positioned between the conformal spacer and the bit line,
wherein the seed liner is thinner than the conformal spacer.
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