CPC H05K 7/20772 (2013.01) | 20 Claims |
1. A modular manifold system for liquid cooling in an information handling system, the modular manifold system comprising:
a first horizontal manifold including:
a first bottom surface;
a first plurality of quick-disconnects mounted along a first surface of the first horizontal manifold; and
a first main water connector mounted on the first surface, the first main water connector connected to and extending away from a first end of the first horizontal manifold; and
a second horizontal manifold including:
a first top surface in physical communication with the first bottom surface of the first horizontal manifold;
a second bottom surface;
a second plurality of quick-disconnects mounted along a second surface of the second horizontal manifold;
a second main water connector mounted on the second surface, the second main water connector connected to and extending away from a second end of the second horizontal manifold, wherein the second main water connector on the second end of the second horizontal manifold is an opposite end from the first main water connector on the first end of the first horizontal manifold; and
a drip tray in physical communication with the second bottom surface of the second horizontal manifold, the drip tray extending away from the second horizontal manifold in a direction perpendicular to the second surface and parallel to the second bottom surface, the drip tray to catch any water leaked from one or more of the first and second plurality of quick-disconnects.
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