US 11,877,424 B2
Cold plate for cooling electronic component
Chao-Jung Chen, Taoyuan (TW); Yu-Nien Huang, Taoyuan (TW); Herman Tan, Taoyuan (TW); and Tien-Juei Chuang, Taoyuan (TW)
Assigned to QUANTA COMPUTER INC., Taoyuan (TW)
Filed by Quanta Computer Inc., Taoyuan (TW)
Filed on May 26, 2022, as Appl. No. 17/825,433.
Claims priority of provisional application 63/333,379, filed on Apr. 21, 2022.
Prior Publication US 2023/0345672 A1, Oct. 26, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20336 (2013.01) [H05K 7/20509 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A cold plate for cooling an electronic component, the
cold plate comprising:
a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and
a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate, the cover having a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate,
wherein the base portion is defined by a peripheral wall, the fluid channel being located adjacent to the peripheral wall,
wherein the base portion further includes a chamber, the fluid channel being located between the peripheral wall and the chamber, and
wherein the fluid channel completely surrounds the chamber.