US 11,877,394 B2
Glass core multilayer wiring board and method of producing the same
Susumu Maniwa, Tokyo (JP); and Masashi Sawadaishi, Tokyo (JP)
Assigned to TOPPAN INC., Tokyo (JP)
Filed by TOPPAN INC., Tokyo (JP)
Filed on May 17, 2022, as Appl. No. 17/746,018.
Application 17/746,018 is a continuation of application No. PCT/JP2020/042767, filed on Nov. 17, 2020.
Claims priority of application No. 2019-208248 (JP), filed on Nov. 18, 2019.
Prior Publication US 2022/0279651 A1, Sep. 1, 2022
Int. Cl. H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0306 (2013.01) [H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 3/4661 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A glass core multilayer wiring board, comprising:
a glass substrate including a first surface, a second surface facing away from the first surface, and a through hole having a diameter which decreases from the first surface toward the second surface;
a through electrode located along a side wall of the through hole; and
a first layer structure formed on the first surface of the glass substrate and a second layer structure formed on the second surface of the glass substrate, wherein
the second layer structure is formed to close an opening of the through hole in the second surface to define a bottom section of the through hole, and wherein
the through electrode includes three layers,
a first layer of the three layers being located on part of the side wall of the through hole closer to the first surface and on part or all of the bottom section of the through hole in the second surface closing the opening of the through hole in the second surface,
a second layer of the three layers being located to cover the first layer, the side wall of the through hole exposed from the first layer, and the bottom section of the through hole in the second surface, and
a third layer of the three layers being located on the second layer.