US 11,877,390 B2
Fabricating tamper-respondent sensors with random three-dimensional security patterns
John S. Werner, Fishkill, NY (US); Jason T. Wertz, Pleasant Valley, NY (US); John Torok, Poughkeepsie, NY (US); Noah Singer, White Plains, NY (US); Arkadiy O. Tsfasman, Wappingers Falls, NY (US); and Budy Notohardjono, Poughkeepsie, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Aug. 30, 2021, as Appl. No. 17/460,421.
Prior Publication US 2023/0068967 A1, Mar. 2, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/0275 (2013.01) [H05K 3/10 (2013.01); H05K 2201/10151 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of fabricating a tamper-respondent sensor, the method comprising:
establishing a security circuit pattern for a security circuit of a tamper-respondent sensor to enclose one or more components of a circuit board within a secure volume, the establishing including:
determining in three dimensions boundaries for the security circuit of the tamper-respondent sensor, the boundaries defining a sensor volume which the security circuit is to fill in three dimensions;
generating at least one trace configuration for the security circuit pattern, the at least one trace configuration defining a random, three-dimensional security pattern to fill the sensor volume, and the at least one trace configuration establishing, at least in part, the security circuit pattern; and
fabricating the tamper-respondent sensor based on the established security circuit pattern.