US 11,877,386 B2
Injection molded article and method for producing same
Yasuisa Takinishi, Kyoto (JP)
Assigned to NISSHA CO., LTD., Kyoto (JP)
Filed by NISSHA CO., LTD., Kyoto (JP)
Filed on Jan. 16, 2023, as Appl. No. 18/154,856.
Application 18/154,856 is a continuation of application No. PCT/JP2021/036239, filed on Sep. 30, 2021.
Claims priority of application No. 2020-171152 (JP), filed on Oct. 9, 2020.
Prior Publication US 2023/0171878 A1, Jun. 1, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 3/14 (2006.01); H05K 3/38 (2006.01); H01L 21/50 (2006.01); H01L 21/78 (2006.01); H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/053 (2006.01); H01L 23/58 (2006.01); H01L 23/373 (2006.01); H01L 23/544 (2006.01); H01L 23/552 (2006.01); B29C 45/14 (2006.01); H05K 3/00 (2006.01); B29L 31/34 (2006.01)
CPC H05K 1/0256 (2013.01) [B29C 45/14336 (2013.01); H05K 3/0014 (2013.01); H05K 3/0091 (2013.01); H05K 3/0094 (2013.01); B29L 2031/3425 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An injection molded article, comprising:
a base sheet in which a first conductive layer is formed on a first surface and a second conductive layer electrically connected to the first conductive layer is formed on a second surface via a conductive material completely filled into a through hole that penetrates from the first surface to the second surface;
a sealing material that is formed on at least the first conductive layer so that it covers the through hole;
a molded resin body that is formed on the base sheet so that it covers the sealing material and composed of an injection molded resin; and
a flexible printed wiring board fixed for electrical connection with a conductive adhesive, wherein the second conductive layer is the conductive adhesive,
wherein the injection molded resin does not enter the through hole, and the injection molded resin is a thermoplastic resin.