US 11,877,044 B2
Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof
Mingzhu Wang, Ningbo (CN); Bojie Zhao, Ningbo (CN); Takehiko Tanaka, Ningbo (CN); Nan Guo, Ningbo (CN); Zhenyu Chen, Ningbo (CN); Zhen Huang, Ningbo (CN); Feifan Chen, Ningbo (CN); and Liang Ding, Zhejiang (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Appl. No. 15/999,858
Filed by NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
PCT Filed Jul. 28, 2016, PCT No. PCT/CN2016/092020
§ 371(c)(1), (2) Date Aug. 5, 2021,
PCT Pub. No. WO2017/140092, PCT Pub. Date Aug. 24, 2017.
Claims priority of application No. 201610091489.7 (CN), filed on Feb. 18, 2016; application No. 201610202500.2 (CN), filed on Apr. 1, 2016; application No. 201620269534.9 (CN), filed on Apr. 1, 2016; application No. 201610250836.6 (CN), filed on Apr. 21, 2016; application No. 201620336842.9 (CN), filed on Apr. 21, 2016; application No. 201610311232.8 (CN), filed on May 11, 2016; and application No. 201620422525.9 (CN), filed on May 11, 2016.
Prior Publication US 2021/0392251 A1, Dec. 16, 2021
Int. Cl. H04N 23/57 (2023.01); H04N 23/55 (2023.01); G06F 1/16 (2006.01); H04N 23/67 (2023.01)
CPC H04N 23/57 (2023.01) [H04N 23/55 (2023.01); G06F 1/1686 (2013.01); H04N 23/67 (2023.01)] 18 Claims
OG exemplary drawing
 
1. A camera module, comprising
at least a lens;
at least a photosensitive chip;
at least a filter;
at least an integral base component;
at least a motor; and
at least a support,
wherein said integral base component comprises a base part and a circuit board part, wherein said base part is integrally packaged in said circuit board part, wherein said photosensitive chip is mounted on said circuit board part, wherein said base part has at least a through hole formed thereon to provide a light path for said photosensitive chip, wherein said lens is arranged along the light path of said photosensitive chip, wherein said support is mounted on said base part, wherein said filter is mounted on said support and along the light path of said photosensitive chip, wherein said base part has a flat extended top surface, wherein said lens is installed on said motor, and wherein said motor is installed on said top surface of said base part.