US 11,876,954 B2
Stitched integrated circuit dies
Nicholas Paul Cowley, Wroughton (GB); and Andrew David Talbot, Chieveley (GB)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Jul. 29, 2022, as Appl. No. 17/816,224.
Application 17/816,224 is a continuation of application No. 16/949,324, filed on Oct. 26, 2020, granted, now 11,438,574.
Prior Publication US 2022/0368885 A1, Nov. 17, 2022
Int. Cl. H04N 17/00 (2006.01); H04N 25/79 (2023.01); H04N 25/771 (2023.01); H01L 27/146 (2006.01)
CPC H04N 17/002 (2013.01) [H04N 25/771 (2023.01); H04N 25/79 (2023.01); H01L 27/14603 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor die comprising:
a plurality of circuitry block instantiations based on a circuitry block, any circuitry block instantiation in the plurality of circuitry block instantiations being configurable to be communicatively coupled to a circuit feature associated with the circuitry block; and
multiplexer circuitry that is between each circuitry block instantiation of the plurality of circuitry block instantiations and the circuit feature and that connects a given circuitry block instantiation of the plurality of circuitry block instantiations to and disconnects each circuitry block instantiation of the plurality of circuitry block instantiations other than the given circuitry block instantiation from the circuit feature based on a stored indication that the given circuitry block instantiation is functional.