US 11,876,551 B2
Electronic module
Shih-Wen Lu, Kaohsiung (TW); Chun-Jen Chen, Kaohsiung (TW); Po-Hsiang Tseng, Kaohsiung (TW); Hsin-Han Lin, Kaohsiung (TW); and Ming-Lun Yu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Aug. 19, 2021, as Appl. No. 17/407,067.
Prior Publication US 2023/0057327 A1, Feb. 23, 2023
Int. Cl. H04B 1/525 (2015.01); H04B 1/04 (2006.01); H04B 1/48 (2006.01); H04B 1/10 (2006.01)
CPC H04B 1/525 (2013.01) [H04B 1/0475 (2013.01); H04B 1/1009 (2013.01); H04B 1/48 (2013.01); H04B 2001/485 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic module, comprising:
a duplexing device including a transmitting part and a receiving part;
a first carrier having a top surface and a bottom surface, wherein the transmitting part is disposed adjacent to one of the top surface and the bottom surface and the receiving part is disposed adjacent to the other one of the top surface and the bottom surface; and
an element configured to block electrical interference between the transmitting part and the receiving part;
a first encapsulant disposed over the top surface of the first carrier and encapsulating the receiving part; and
a second encapsulant disposed under the bottom surface of the first carrier and encapsulating the transmitting part.