US 11,876,501 B2
Acoustic wave device with multi-layer substrate including ceramic
Hironori Fukuhara, Ibaraki (JP); Rei Goto, Osaka (JP); and Keiichi Maki, Suita (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Feb. 25, 2020, as Appl. No. 16/800,248.
Claims priority of provisional application 62/810,649, filed on Feb. 26, 2019.
Claims priority of provisional application 62/810,707, filed on Feb. 26, 2019.
Prior Publication US 2020/0274517 A1, Aug. 27, 2020
Int. Cl. H03H 9/02 (2006.01); H03H 9/25 (2006.01); H03H 9/145 (2006.01); H03H 9/72 (2006.01); H03H 9/64 (2006.01); H03H 9/05 (2006.01); H03H 3/10 (2006.01); H10N 30/072 (2023.01)
CPC H03H 9/02574 (2013.01) [H03H 3/10 (2013.01); H03H 9/02031 (2013.01); H03H 9/02559 (2013.01); H03H 9/02834 (2013.01); H03H 9/0585 (2013.01); H03H 9/14502 (2013.01); H03H 9/25 (2013.01); H03H 9/6406 (2013.01); H03H 9/725 (2013.01); H10N 30/072 (2023.02)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave device comprising:
a support substrate;
a ceramic layer over the support substrate, the ceramic layer having a thickness that is at least equal to or greater than a wavelength A of the acoustic wave device to suppress spurious modes resulting from back scattering, the support substrate having a higher thermal conductivity than the ceramic layer;
a piezoelectric layer over the ceramic layer; and
an interdigital transducer electrode over the piezoelectric layer, the acoustic wave device configured to generate an acoustic wave.