CPC H03F 3/211 (2013.01) [H03F 1/0227 (2013.01); H03F 1/0261 (2013.01); H03F 1/565 (2013.01); H03F 3/191 (2013.01); H03F 3/195 (2013.01); H04B 1/0475 (2013.01); H03F 2200/451 (2013.01); H03F 2203/21142 (2013.01); H04B 2001/0416 (2013.01)] | 20 Claims |
1. A radio-frequency module comprising:
a packaging substrate configured to receive a plurality of components; and
a power amplification system implemented on the packaging substrate, the power amplification system including a power amplifier configured to be powered by a power supply and a control system, the control system including an interface configured to receive a transceiver control signal from a transceiver, the interface including one or more control registers including one or more power amplifier control registers and one or more power supply control registers, the control system further including a power amplifier control component configured to generate a power amplifier control signal to control the power amplifier based on the transceiver control signal received from the transceiver and configured to generate a local control signal, the power amplifier control component configured to overwrite one or more of the power supply control registers with the local control signal, the control system further including a power supply component configured to generate a power supply control signal to control the power supply based on one or more of the transceiver control signal and the local control signal.
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