US 11,876,490 B2
Compensation of thermally induced voltage errors
Sandeep Shylaja Krishnan, Bangalore (IN); Akshay Yashwant Jadhav, Pune (IN); and Tallam Vishwanath, Bangalore (IN)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Jan. 28, 2022, as Appl. No. 17/587,105.
Claims priority of application No. 202141016997 (IN), filed on Apr. 12, 2021.
Prior Publication US 2022/0329211 A1, Oct. 13, 2022
Int. Cl. H03F 1/30 (2006.01); G05F 3/26 (2006.01)
CPC H03F 1/303 (2013.01) [G05F 3/267 (2013.01); H03F 2200/375 (2013.01); H03F 2200/447 (2013.01); H03F 2200/468 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An integrated circuit for temperature gradient compensation of a bandgap voltage, the integrated circuit comprising:
a bandgap core circuit having a bandgap feedback input, a bandgap adjustment input and a bandgap reference output;
a compensation resistor coupled between the bandgap adjustment input and a ground terminal;
an offset and slope correction circuit having an offset correction output coupled to the bandgap adjustment input;
a thermal error cancellation (TEC) circuit having a TEC output coupled to the bandgap adjustment input, the TEC circuit including first and second temperature sensors spaced from each other, the TEC circuit configured to provide a signal at the TEC output responsive to temperatures at the first and second temperature sensors; and
an amplifier having an amplifier input and an amplifier output, the amplifier input coupled to the bandgap reference output.