| CPC H02M 1/325 (2021.05) [H02M 7/219 (2013.01)] | 8 Claims |
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1. A method for operating an electronic module comprising at least three semiconductor elements, the electronic module comprising at least six semiconductor elements disposed in three half-bridges, each having an upper branch and a lower branch, the method comprising:
passing a current, in the event of a defect in one of the semiconductor elements, via the defective semiconductor element by selectively activating at least two of the remaining semiconductor elements in order to destroy or open-circuit the defective semiconductor element or a weak point associated with the defective semiconductor element, wherein this current is distributed between the selectively activated semiconductor elements;
selectively actuating, in the event of a defect in one of the semiconductor elements in the upper branch in one of the half-bridges, the two semiconductor elements in the upper branch of the other two half-bridges in order to destroy or open-circuit the defective semiconductor element or the weak point associated with the defective semiconductor element; and
selectively actuating, in the event of a defect in one of the semiconductor elements in the lower branch in one of the half-bridges, the two semiconductor elements in the lower branch of the other two half-bridges in order to destroy or open-circuit the defective semiconductor element or the weak point associated with the defective semiconductor element.
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