US 11,876,364 B2
Multilayer electronic components with soldered through holes
Shuai Wang, Singapore (SG); Chandana J. Gajanayake, Singapore (SG); and David R. Trawick, Indianapolis, IN (US)
Assigned to Rolls-Royce Corporation, Indianapolis, IN (US)
Filed by Rolls-Royce Corporation, Indianapolis, IN (US)
Filed on Mar. 7, 2022, as Appl. No. 17/688,469.
Prior Publication US 2023/0283057 A1, Sep. 7, 2023
Int. Cl. H02G 5/00 (2006.01)
CPC H02G 5/005 (2013.01) 19 Claims
OG exemplary drawing
 
1. A multi-layer bus bar assembly comprising,
a capacitor having a body and a first electrical connection pin that extends away from the body along an axis,
a multi-layer bus bar that includes
a positive rail that includes a plurality of first conductive layers and a plurality of first inter-insulation layers, wherein each of the plurality of first inter-insulation layers is located axially between neighboring first conductive layers included in the plurality of first conductive layers,
a negative rail that includes a plurality of second conductive layers and a plurality of second inter-insulation layers, wherein each of the plurality of second inter-insulation layers is located axially between neighboring second conductive layers included in the plurality of second conductive layers, and
a main insulation layer positioned between the positive rail and the negative rail,
wherein the plurality of first conductive layers are formed to assist in the joining of the plurality of first conductive layers with the first electrical connection pin, the plurality of first conductive layers including a first layer and a second layer axially neighboring the first layer, the first layer formed to define a first cutout shaped with a soldering pattern arranged about the axis, and the second layer formed to define a second cutout shaped with the soldering pattern arranged around the axis, and
wherein the soldering pattern includes a discrete first through hole located on the axis and receives the first electrical connection pin and a discrete second through hole spaced apart radially from the first through hole relative to the axis.