CPC H01M 50/26 (2021.01) [H01M 10/613 (2015.04); H01M 10/653 (2015.04); H01M 10/6551 (2015.04); H01M 50/284 (2021.01); H01M 50/507 (2021.01); H01M 50/522 (2021.01); H01M 50/528 (2021.01); H01M 50/552 (2021.01)] | 15 Claims |
1. A module layer embodied as a structural unit, comprising:
a plurality of elementary cells, which are electrically connected to one another in series circuits and parallel circuits,
wherein the cells of the module layer in a tray are positioned on a base element of the tray and are enclosed by an outer frame that is embodied as a heat sink and constitutes a rim of the tray, the outer frame has a seal, and in a central region of the base element, the tray has a section of a central shaft into which bus bars protrude, which produce a conductive connection with the cells of the respective module layer.
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