CPC H01L 31/1876 (2013.01) [H01L 31/0481 (2013.01); H01L 31/0512 (2013.01); H01L 31/0516 (2013.01); H01L 31/1804 (2013.01)] | 6 Claims |
1. A method for fabricating a photovoltaic (PV) module, comprising:
(S1) placing a solder ribbon on at least one side of a crystalline silicon solar cell;
covering a first polymer material on the at least side of the crystalline silicon solar cell where the solder ribbon is placed, followed by heating at a first temperature to bond the polymer material to the crystalline silicon solar cell, so as to attach the solder ribbon to the crystalline silicon solar cell to form a solar cell module; and
successively or simultaneously preparing a plurality of solar cell modules, and connecting the plurality of solar cell modules in series by the solder ribbon to form a solar cell string; connecting a plurality of solar cell strings in series and/or in parallel through a busbar to form a solar cell array; and introducing a second polymer material to fill gaps in the solar cell array, wherein the second polymer material is the same as the first polymer material;
wherein the first polymer material is an isotropic homogeneous film composed of a single substance; a thickness of the first polymer material on a side of the solar cell module is 0.02-0.25 mm; a total thickness of the first polymer material and the second polymer material on the same side of the solar cell array is 0.4-0.6 mm; and
the first temperature is 70-130° C. excluding 130° C., and the heating is performed for 1-5 s;
(S2) laying a first sealing plate on a first side of the solar cell array, and laying a second sealing plate on a second side of the solar cell array to form a stacked body;
(S3) subjecting the stacked body obtained in step (S2) to lamination at a second temperature to enable a soldering layer of the solder ribbon to be melted and soldered with a grid line of the crystalline silicon solar cell to form an ohmic contact, and allow softening of the first polymer material and the second polymer material to form a filler layer to package the solar cell array, thereby producing the PV module;
wherein a softening point of the first polymer material and the second polymer material is no more than the first temperature; the first temperature is less than a melting point of the soldering layer of the solder ribbon, and the melting point of the soldering layer of the solder ribbon is less than or equal to the second temperature;
and the second temperature is 130-170° C.
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