US 11,876,109 B2
Semiconductor devices with single-photon avalanche diodes and light spreading lenses
Brian Patrick McGarvey, Templemartin (IE)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on May 6, 2020, as Appl. No. 16/868,040.
Prior Publication US 2021/0351222 A1, Nov. 11, 2021
Int. Cl. H01L 27/146 (2006.01); H01L 31/0232 (2014.01); H01L 31/107 (2006.01); H01L 31/02 (2006.01)
CPC H01L 27/14643 (2013.01) [H01L 27/14627 (2013.01); H01L 31/02327 (2013.01); H01L 31/107 (2013.01); H01L 31/02027 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor substrate that includes a plurality of single-photon avalanche diodes;
a glass layer that covers the semiconductor substrate; and
a groove in the glass layer that overlaps the plurality of single-photon avalanche diodes, wherein the groove receives incident light distributed across a first width and spreads the light to be distributed across a second width at the plurality of single-photon avalanche diodes and wherein the second width is greater than the first width.