US 11,876,083 B2
Semiconductor package
Dongho Kim, Daegu (KR); Ji Hwang Kim, Cheonan-si (KR); Hwan Pil Park, Hwaseong-si (KR); and Jongbo Shim, Asan-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 20, 2021, as Appl. No. 17/407,647.
Claims priority of application No. 10-2020-0164363 (KR), filed on Nov. 30, 2020.
Prior Publication US 2022/0173082 A1, Jun. 2, 2022
Int. Cl. H01L 23/02 (2006.01); H01L 25/10 (2006.01); H01L 25/065 (2023.01); H01L 21/48 (2006.01)
CPC H01L 25/105 (2013.01) [H01L 21/4882 (2013.01); H01L 25/0655 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a lower package including a lower substrate and at least one lower semiconductor chip;
an interposer substrate on the lower package, the interposer substrate including a plurality of holes that penetrate the interposer substrate;
a thermal radiation structure including a supporter on a top surface of the interposer substrate and a plurality of protrusions in the holes of the interposer substrate; and
a thermal conductive layer between the lower semiconductor chip and the protrusions of the thermal radiation structure.