CPC H01L 24/45 (2013.01) [H01L 24/48 (2013.01); H01L 23/49582 (2013.01); H01L 24/05 (2013.01); H01L 24/85 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05638 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/45601 (2013.01); H01L 2224/45617 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/4852 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48839 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/85045 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85379 (2013.01); H01L 2224/85395 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01034 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20752 (2013.01)] | 13 Claims |
1. A wire bonding structure, comprising: an aluminum-containing electrode of a semiconductor chip; a bonding wire; and a ball bonding portion between the electrode and the bonding wire, wherein
the bonding wire is a palladium-coated copper bonding wire including: a core material containing copper as a main component; and a palladium layer on the core material and containing a sulfur group element, the palladium-coated copper bonding wire in which with respect to a total of copper, palladium, and the sulfur group element, a concentration of palladium is 1.0 mass % or more and 4.0 mass % or less and a total concentration of the sulfur group element is 50 mass ppm or less, and a concentration of sulfur is 5 mass ppm or more and 12 mass ppm or less, a concentration of selenium is 5 mass ppm or more and 20 mass ppm or less, or a concentration of tellurium is 15 mass ppm or more and 50 mass ppm or less, and
the wire bonding structure includes a palladium-concentrated bonding region with the concentration of palladium being 2.0 mass % or more relative to a total of aluminum, copper, and palladium near a bonding surface of the electrode and the ball bonding portion.
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