US 11,876,065 B2
Flip chip package assembly
Katleen Fajardo Timbol, Tarlac (PH); Salvatore Frank Pavone, Murphy, TX (US); and Rafael Jose Lizares Guevara, Manila (PH)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Sep. 30, 2021, as Appl. No. 17/491,496.
Prior Publication US 2023/0104156 A1, Apr. 6, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/027 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 21/027 (2013.01); H01L 24/04 (2013.01); H01L 24/11 (2013.01); H01L 2221/1068 (2013.01); H01L 2224/022 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/014 (2013.01); H01L 2924/177 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a semiconductor die having a device side surface;
bond pads on the semiconductor die on the device side surface;
post connects having a proximate end on the bond pads and extending from the bond pads to a distal end, the diameter of the post connects including a uniform diameter from the proximate end to the distal end;
polyimide material covering sides of the post connects from the proximate end till the distal end, and covering at least a portion of the bond pads;
solder on the distal end of the post connects; and
a portion of a lead frame physically contacting the solder.