US 11,876,039 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Roger D. St. Amand, Tempe, AZ (US); and Louis W. Nicholls, Gilbert, AZ (US)
Assigned to Amkor Technol Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on Jun. 11, 2022, as Appl. No. 17/838,200.
Application 17/838,200 is a division of application No. 16/805,027, filed on Feb. 28, 2020, granted, now 11,362,027, issued on Jun. 14, 2022.
Prior Publication US 2022/0319969 A1, Oct. 6, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49816 (2013.01) [H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3185 (2013.01); H01L 23/49822 (2013.01); H01L 24/11 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/73253 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate comprising a substrate top side, an opposing substrate bottom side, and a conductive structure, wherein:
the conductive structure comprises:
substrate top terminals adjacent to the substrate top side;
substrate bottom terminals adjacent to the substrate bottom side; and
conductive paths coupling the substrate top terminals to the substrate bottom terminals;
a first electronic component comprising:
a first electronic component first side;
a first electronic component second side opposite to the first electronic component first side; and
first component terminals adjacent to the first electronic component first side and coupled to the substrate bottom terminals;
a second electronic component comprising:
a second electronic component first side;
a second electronic component second side opposite to the second electronic component first side and coupled to the first electronic component second side with an attachment structure; and
second component terminals adjacent to the second electronic component first side;
interconnects coupled to the substrate bottom terminals; and
a bottom encapsulant covering the substrate bottom side, the first electronic component, the second electronic component, the attachment structure, and the interconnects;
wherein:
the first electronic component and the second electronic component are interposed between the second component terminals and the substrate bottom side;
distal ends of the interconnects and distal ends of the second component terminals are substantially coplanar;
the bottom encapsulant and the attachment structure are different materials; and
portions of the second component terminals and the interconnects are exposed from the bottom encapsulant.