US 11,876,035 B2
Liquid-cooled chip
Gilles Simon, Grenbole (FR)
Assigned to Commissariat à l'Energie Atomique et aux Energies Alternatives, Paris (FR)
Filed by Commissariat à l'Energie Atomique et aux Energies Alternatives, Paris (FR)
Filed on Mar. 17, 2021, as Appl. No. 17/249,892.
Claims priority of application No. 2002710 (FR), filed on Mar. 19, 2020.
Prior Publication US 2021/0296209 A1, Sep. 23, 2021
Int. Cl. H01L 23/473 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 21/4882 (2013.01)] 14 Claims
OG exemplary drawing
 
1. System comprising:
an electronic chip formed on top and inside of a semiconductor substrate comprising, one the side of a first surface, at least one active component and, on the side of a second surface opposite to the first surface, at least one channel for the circulation of a liquid intended to cool the chip; and
a block made of an organic material surrounding the chip on all its lateral surfaces, the block comprising at least one second channel for the circulation of a liquid.